HY-9055 is a kind of two-component electronic encapsulates with low viscosity with flame Resistance and thermal conductivity. It can get cured under room temperature or heated. The higher the temperature is, the faster the curing speed will be. The raw material with higher purity, does not contain any polar compounds and does not produce any By-products, so it can remain the better electrical performance in the hard conditions. It can be applied to the surface of polycarbonate, PP, ABS, PVC and metal material, and also for Insulation, moisture-proof, waterproof, shockproof, electronic components, Typical uses for protection of module power supply and circuit board potting high-power electronic components which has high requirements for elimination of heat and high temperature resistance.
Any interest, contact JoJo to get the free sample to test the silicone quality.
Mob: 86-18938867553
Email: hyxz@szrl.net
Skype: siliconerubber@outlook.com
Post time: Jun-27-2017