Discountable price SV-8800 Silicone Sealant for Insulating Glass for Peru Manufacturer
Short Description:
Description SV-8800 is two components, high modulus; neutral curing silicone sealant specifically developed for assembly of high performance insulated glass units as secondary sealing material. Where to use It is a two-component silicone that offers variable work life with high bonding strength to maintain the integrity of insulating glass unit, suits both commercial and residential IGU. Key Features 1. High Modulus 2. UV resistance 3. Low vapor and gas transmission 4. Primerless adhesion...
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Description
SV-8800 is two components, high modulus; neutral curing silicone sealant specifically developed for assembly of high performance insulated glass units as secondary sealing material.
Where to use
It is a two-component silicone that offers variable work life with high bonding strength to maintain the integrity of insulating glass unit, suits both commercial and residential IGU.
Key Features
1. High Modulus
2. UV resistance
3. Low vapor and gas transmission
4. Primerless adhesion to coated glass
5. 100% compatible to SV-8890
Technical data sheet
Test standard | Test project | Unit | value |
Before curing——25℃,50%R.H. | |||
GB13477 | Specific gravity(After mixing) | 1.33 | |
GB13477 | Operating time | min | 20-40 |
GB13477 | surface drying time(25℃,50%R.H.) | min | 80-188 |
corrosivity | No | ||
7 days after curing——25℃,50%R.H. | |||
GB/T 531 | Durometer Hardness | Shore A | 40 |
GB13477 | The tensile modulus at 12.5% elongation | Mpa | 0.18 |
The ultimate tensile strength | Mpa | 0.92 | |
GB13477 | Elongation limit (fracture) | % | 150 |
Certification
GB-24266-2009;
Color
Component A(Base) – White, Component B(Catalyst)- Black
Package
1. Component A(Base): (190L), Component B(Catalyst) (18.5L)
2. Component A(Base):24.5kg (18L), Component B(Catalyst): 1.9kg (1.8L)
Shelf life
12 months
Note
If you want the TDS or MSDS or other details, please contact with our sales person.
Most work in flexible electronics focuses on organic semiconductors, which are limited in performance and thermal stability compared to conventional silicon-based electronics. Making flexible silicon, requires thin silicon; however cost is high (back-side grinding generates a lot of waste). Alternative methods involve transfer to a plastic substrate, therefore, limited integration density, and use of a higher cost wafer.
Researchers at the KAUST Integrated Nanotechnology lab came up with a simple, novel fabrication process to derive thin (5 micron), mechanically flexible, optically transparent, porous monocrystalline silicon (up to 18 cm2) from a low-cost silicon (100) wafer. FlexSi, as the innovation was named, is usable for flexible membrane and high performance electronics on flexible substrates.
This technology is part of KAUST’s technology commercialization program that seeks to stimulate development and commercial use of KAUST-developed technologies. For more information: https://buff.ly/1irFTSm