8 Years Manufacturer SV-312 Polyurethane Sealant for Windshield Glazing for Munich Manufacturers

Fast and good quotations, informed advisers to help you choose the correct product that suits all your needs, a short production time, responsible quality control and different services for paying and shipping affairs for 8 Years Manufacturer SV-312 Polyurethane Sealant for Windshield Glazing for Munich Manufacturers, We sincerely welcome domestic and foreign merchants who calls, letters asking, or to plants to negotiate, we will offer you quality products and the most enthusiastic service,We look forward to your visit and your cooperation.

Description

SV-312  is an isocyanate-free, high modulus,non conductive, thixotropic, single component modified polyurethane adhesive, which polymerizes rapidly under the effect of atmospheric moisture. It has been specially designed for bonding of fixed glass in automotive repair.

It allows a drive away time of 6 hours in vehicles with or without airbag.

*Providing the ambient temperature is at least 23°C and relative humidity 50 %.

At lower temperatures and humidities drive away time will be longer.

Where to use

Bonding and sealing for windshield glass, glass fiber reinforced plastic fittings, steel and aluminum board of automobiles.

Key Features

a. Fast curing under room temperature, no sagging, solvent free

b. High bonding strength, 

c. Good chemical and water resistance

d. No conductive

e. Excellent noise, vibration and impaction resistance

f. Automotive OEM quality

Technical data sheet

Color

White, black, grey

Package

300ml plastic cartridges and 600ml in sausage

Shelf life

9 months 

Note

If you want the TDS or MSDS or other details, please contact with our sales person.

Temporary wafer bonding for thin wafer processing is one of the key technologies of 3D system integration. AIT is proud to add to its wafer processing materials solutions with an innovative family of temporary bonding film and spin coating solutions for temporary bonding of silicon device wafers to carrier wafers using traditional low temperature and low pressure thermo-compression process.

AIT is the first known to provide a film format of its high temperature temporary bonding adhesives for thin wafer processing. Leveraging its expertise of film adhesive manufacturing for semiconductor industry for the last 30+ years, wafer processing adhesive are available from 5 micron to 80 micron for device wafers up to 450mm with and without topography. AIT high temperature capable wafer processing adhesives can all be removed with heat-sliding and solvent assisted release separation process with the adhesive on device and carrier wafers removed without additional cleaning in most applications. The WPA-TL 330 can also be removed with laser assisted process.

AIT temporary bonding wafer processing adhesives are thermally stable to 3200-330°C and compatibility of the bonded compound wafers with standard WLP process equipment and for backside processing of 3DTSV wafers. High integrity in bond strength enables ease in back grinding to a thickness of 50 µm. Other device wafer processing such as dry etching, wet etching, CMP, PVD, solvent based spin coating of resists and polymers, lithography, electro plating and other elevated temperature processing up to 320-330°C for at least 60 minutes under high vacuum are built in the thermally and chemically stable novel polymers.

Besides the first to make available film formats of the high temperature wafer processing adhesives, AIT WPA-TS 320 and WPA-TL 330 in comparison to traditional and polyimide based temporary handling solutions, also offers one of the highest temperature and time of processing windows for thin wafer processing as well as ease of removal and cleaning.

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